Sample preparation is a critical step for the failure analysis process, and can often condition its result. We have at our disposal instruments allowing the depackaging, the cross sectioning, polishing and thinning of all types of components.
Cross section on
optoelectronic
component
Depackaging and backside thinning
of a Silicon component
on TSOP32 package
Metallographic
Cross section
on a PCB
See below to find our other techniques
